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2,4-dibromo-6-methylpyridine
Molecular Formula:

Molecular Weight:

Purity:99%
light curing resin low viscosity epoxy resin
CAS:

Molecular Formula:

Molecular Weight:

Purity:99%
2-Hydroxychalcone
Molecular Formula:C15H12O2

Molecular Weight:

Purity:99%
5-Methylsalicylic acid
Molecular Formula:C8H8O3

Molecular Weight:

Purity:99%
3-(Acetylthio)-2-methylpropionicacidmethylester
Molecular Formula:

Molecular Weight:

Purity:99%
3-Methylthio-1,2,4-triazine
Molecular Formula:C4H5N3S

Molecular Weight:

Purity:99%
3,6-Dihydroxynaphthalene-2,7-disulfonicacid,disodiumsalt
Molecular Formula:C10H6Na2O8S2

Molecular Weight:

Purity:99%
2,4,7-trichloroquinazoline
Molecular Formula:C8H3Cl3N2

Molecular Weight:

Purity:99%
syn-2-Pyridinealdoxime
Molecular Formula:C6H6N2O

Molecular Weight:

Purity:99%
2-Chlorobenzaldehyde oxime
Molecular Formula:C7H6 Cl N O

Molecular Weight:

Purity:99%
4-sulfo-1,8-naphthalicanhydride,potassiumsalt,
Molecular Formula:C12H6 O6 S . K

Molecular Weight:

Purity:99%
2-(bromomethyl)-1-chloro-3-nitrobenzene
Molecular Formula:C7H5 Br Cl N O2

Molecular Weight:

Purity:99%

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